Wire Bonding Dual-Sided Mcma Modules

Abstract

Conventional package design of integrated circuit packages utilizes only one side of the package substrate. The MCM-L package with it's multi-laminate PC-board structure provides a rigidity to the substrate for assembly such that assembly may be performed on both sides of the package. The dual-sided MCM-L package with active chips attached to both sides of the substrate makes more effective use of substrate surface area. The same or similar chip set (combination of ASIC and memory chips) used in a 40mm package with assembly on one side, may be placed onto a dual-sided MCM-L substrate with a 28mm package size. The tooling used is designed to allow for re- insertion of the package into the bonder work holder bond site without damage to previous assembly. The tooling for processing a rigid substrate dual-sided MCM-L package differs from that of the conventional tooling set, and accomplishes two major goals. One, it provides a relief area for previous assembly to prevent physical damage to chips and wires, and heats the package area beneath the cavity to bond temperatures for fully automatic wire bonding.