Kyunghyun Son, Dongjae Shin, Jisan Lee, Bongyong Jang, Dongsik Shim, H. Byun, Chang-Bum Lee, Yongchul Cho, Tatsuhiro Otsuka, C. Shin, Inoh Hwang, Eunkyung Lee, Kyoungho Ha, H. Choo
{"title":"Palm-sized LiDAR module with III/V-on-Si optical phased array","authors":"Kyunghyun Son, Dongjae Shin, Jisan Lee, Bongyong Jang, Dongsik Shim, H. Byun, Chang-Bum Lee, Yongchul Cho, Tatsuhiro Otsuka, C. Shin, Inoh Hwang, Eunkyung Lee, Kyoungho Ha, H. Choo","doi":"10.1109/vlsitechnologyandcir46769.2022.9830467","DOIUrl":null,"url":null,"abstract":"We have implemented a compact, highly accurate light detection and ranging (LiDAR) module using our III/V-on-Si optical phased array (OPA). Our module measures only 1.4 liter in volume, and we demonstrated 20-m ranging and 10-m 3D imaging with 1-cm accuracy under 100-klx bright sunlight. The accuracy was improved by 300% from our previous work [1] by employing sub-binning-based digital signal processing (DSP). The small size and its robust 3D depth-sensing performance promise strong commercial viability.","PeriodicalId":332454,"journal":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830467","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We have implemented a compact, highly accurate light detection and ranging (LiDAR) module using our III/V-on-Si optical phased array (OPA). Our module measures only 1.4 liter in volume, and we demonstrated 20-m ranging and 10-m 3D imaging with 1-cm accuracy under 100-klx bright sunlight. The accuracy was improved by 300% from our previous work [1] by employing sub-binning-based digital signal processing (DSP). The small size and its robust 3D depth-sensing performance promise strong commercial viability.