Advanced interconnected mesh power system (IMPS) MCM topologies

Abstract

A design implementation package for the automation of advanced IMP MCM topologies has been developed. The IMPS topology is a patented development of the University of Arkansas which allows a complete MCM with low impedance power distribution and dense signal interconnect, to be built on only two metal layers. The IMPS topology consists of a large number of interwoven power distribution lines. The large volume of layout structures in the IMPS topology, requires the assistance of a computer-aided design package. This paper describes advanced IMPS topologies and how the IMPS design package, along with Mentor Graphics MCM Design Station, implement the different types of meshes. An example design is used to illustrate the use of the methodology. The advanced IMPS topologies described include the nonuniform IMPS mesh, which allows for higher signal interconnect density at congested locations; the partitioned IMPS mesh, which allows for different mesh structures at different locations in the same design and the asymmetric IMPS mesh, which allows for variations in power supply impedances.