Reliability of Printed Microwave Electronics

S. Neermann, J. Franke, M. Sippel, K. Lomakin, G. Gold
{"title":"Reliability of Printed Microwave Electronics","authors":"S. Neermann, J. Franke, M. Sippel, K. Lomakin, G. Gold","doi":"10.1109/ECTC32696.2021.00283","DOIUrl":null,"url":null,"abstract":"In recent years, the focus of research and industry in the field of printed electronics has been primarily on challenges relating to process improvements like resolution and process stability or material improvements. In contrast, environmental simulation on-tests such as temperature shock tests or humidity-heat tests and their effects on electrical and mechanical properties as well as the high frequency (HF) properties of printed structures have hardly been considered so far. However, such environmental requirements for electronic components are particularly important for reliable use in all areas of printed electronics. In this paper, environmental simulation tests on printed conductive structures were therefore carried out and their effects on the electrical conductivity and microwave frequency properties were measured, analyzed and evaluated. The common environmental simulation test methods as well as their purpose and implementation variants are examined in detail for this purpose. Based on these fundamentals, first of all the selected substrate material RO4350B is printed with a conductive silver paste according to microwave frequency technical specifications using a dispensing printing process and sintered according to the manufacturers specifications. The substrate material has a relative permittivity $\\varepsilon_{r}=3.48$ on which the geometry of the additively produced structures depends. To achieve the required characteristic impedance $Z_{L}\\approx 50\\ \\Omega$, a width of $1080\\ \\mu\\mathrm{m}$ must be reached. The printed samples are then subjected to various environmental simulation tests and examined using various measurement procedures. For the long-term reliability tests, the temperature shock test between −40°C and 140 °C for 1000 cycles, the humidity-heat test with 85°C and 85% relative humidity for 1000 h and the vibration test were selected according to DIN EN 60068. The evaluation methods are to focus on the effects of the environmental simulation tests on electrical and mechanical properties as well as the influence on the high-frequency properties. The conductivity is measured by means of four-wire measurement. A comparison was made of the electrical conductivity in the sintered state, during the reliability tests and at the end of the tests. The samples in the thermal shock test were examined after 250 cycles, 500 cycles, 750 cycles and 1000 cycles to make premature failures of the samples visible. In the moisture-heat test the samples were taken and examined after 500 h and 1000 h. The detection of defects and cracks is carried out using optical control. To determine the high-frequency characteristics, a 2-port measurement of the S-parameters up to 12 GHz was performed. The insertion loss without impact from the transitions was determined using a multi-line method. It can be summarized that the reliability tests have no significant influence on the insertion loss of the printed samples compared to the sintered references. While, especially in the temperature shock test, a change in electrical conductivity and isolated crack formations can be measured. This change regarding conductivity is due to the post-sintering effect caused by temperature exposure during reliability studies and suggests that the sintering time and method recommended by the manufacturer must be adjusted.","PeriodicalId":351817,"journal":{"name":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32696.2021.00283","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

In recent years, the focus of research and industry in the field of printed electronics has been primarily on challenges relating to process improvements like resolution and process stability or material improvements. In contrast, environmental simulation on-tests such as temperature shock tests or humidity-heat tests and their effects on electrical and mechanical properties as well as the high frequency (HF) properties of printed structures have hardly been considered so far. However, such environmental requirements for electronic components are particularly important for reliable use in all areas of printed electronics. In this paper, environmental simulation tests on printed conductive structures were therefore carried out and their effects on the electrical conductivity and microwave frequency properties were measured, analyzed and evaluated. The common environmental simulation test methods as well as their purpose and implementation variants are examined in detail for this purpose. Based on these fundamentals, first of all the selected substrate material RO4350B is printed with a conductive silver paste according to microwave frequency technical specifications using a dispensing printing process and sintered according to the manufacturers specifications. The substrate material has a relative permittivity $\varepsilon_{r}=3.48$ on which the geometry of the additively produced structures depends. To achieve the required characteristic impedance $Z_{L}\approx 50\ \Omega$, a width of $1080\ \mu\mathrm{m}$ must be reached. The printed samples are then subjected to various environmental simulation tests and examined using various measurement procedures. For the long-term reliability tests, the temperature shock test between −40°C and 140 °C for 1000 cycles, the humidity-heat test with 85°C and 85% relative humidity for 1000 h and the vibration test were selected according to DIN EN 60068. The evaluation methods are to focus on the effects of the environmental simulation tests on electrical and mechanical properties as well as the influence on the high-frequency properties. The conductivity is measured by means of four-wire measurement. A comparison was made of the electrical conductivity in the sintered state, during the reliability tests and at the end of the tests. The samples in the thermal shock test were examined after 250 cycles, 500 cycles, 750 cycles and 1000 cycles to make premature failures of the samples visible. In the moisture-heat test the samples were taken and examined after 500 h and 1000 h. The detection of defects and cracks is carried out using optical control. To determine the high-frequency characteristics, a 2-port measurement of the S-parameters up to 12 GHz was performed. The insertion loss without impact from the transitions was determined using a multi-line method. It can be summarized that the reliability tests have no significant influence on the insertion loss of the printed samples compared to the sintered references. While, especially in the temperature shock test, a change in electrical conductivity and isolated crack formations can be measured. This change regarding conductivity is due to the post-sintering effect caused by temperature exposure during reliability studies and suggests that the sintering time and method recommended by the manufacturer must be adjusted.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
印刷微波电子器件的可靠性
近年来,印刷电子领域的研究和工业重点主要集中在与分辨率和工艺稳定性或材料改进等工艺改进有关的挑战上。相比之下,环境模拟试验,如温度冲击试验或湿热试验,以及它们对印刷结构的电气和机械性能以及高频(HF)性能的影响迄今几乎没有考虑。然而,这种对电子元件的环境要求对于在印刷电子的所有领域中可靠使用尤为重要。因此,本文对印刷导电结构进行了环境模拟试验,并对其电导率和微波频率性能的影响进行了测量、分析和评价。为此,详细研究了常见的环境模拟测试方法及其目的和实现变体。基于这些基本原理,首先选用基板材料ro450b,根据微波频率技术规范,采用点胶印刷工艺,用导电银浆进行印刷,并按照厂家规格进行烧结。所述衬底材料具有相对介电常数$\varepsilon_{r}=3.48$,所述增材制造的结构的几何形状取决于该介电常数。为了达到所需的特性阻抗$Z_{L}\approx 50\ \Omega$,必须达到$1080\ \mu\mathrm{m}$的宽度。然后将打印的样品进行各种环境模拟测试,并使用各种测量程序进行检查。对于长期可靠性试验,温度冲击试验在−40℃~ 140℃之间进行1000次循环,湿热试验在85℃~ 85℃之间进行% relative humidity for 1000 h and the vibration test were selected according to DIN EN 60068. The evaluation methods are to focus on the effects of the environmental simulation tests on electrical and mechanical properties as well as the influence on the high-frequency properties. The conductivity is measured by means of four-wire measurement. A comparison was made of the electrical conductivity in the sintered state, during the reliability tests and at the end of the tests. The samples in the thermal shock test were examined after 250 cycles, 500 cycles, 750 cycles and 1000 cycles to make premature failures of the samples visible. In the moisture-heat test the samples were taken and examined after 500 h and 1000 h. The detection of defects and cracks is carried out using optical control. To determine the high-frequency characteristics, a 2-port measurement of the S-parameters up to 12 GHz was performed. The insertion loss without impact from the transitions was determined using a multi-line method. It can be summarized that the reliability tests have no significant influence on the insertion loss of the printed samples compared to the sintered references. While, especially in the temperature shock test, a change in electrical conductivity and isolated crack formations can be measured. This change regarding conductivity is due to the post-sintering effect caused by temperature exposure during reliability studies and suggests that the sintering time and method recommended by the manufacturer must be adjusted.
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment nSiP(System in Package) Platform for various module packaging applications IEEE 71st Electronic Components and Technology Conference [Title page] Evaluation of Low-k Integration Integrity Using Shear Testing on Sub-30 Micron Micro-Cu Pillars CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1