Metal-semiconductor-metal photodiodes on textured silicon membranes

H.C. Lee, B. Zeghbroeck
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Abstract

High-speed and high-responsivity silicon photodetectors, which can be readily integrated with electronics, would make silicon-based optoelectronic receivers the preferred technology for short distance fiber-optic and free-space optical communication.. However, the long absorption length in silicon (-10 pm at 830 nm) results in detectors with a poor high-speed response. Previous work [l-31 focused on reducing the absorption length by reducing the wavelength (1 pm at 630 nm and 0.1 pm at 400 nm) even though fiber attenuation is more favorable at longer wavelength, whilc light sources are more readily available at 830 nm. In this paper, we present a novel silicon Metal-Semiconductor-Metal (MSM) photodetector structure with a 3.0 GHz bandwidth and 0.17 A/W DC responsivity at 830 nm. The fabrication process is simple and relies on conventional silicon fabrication processes. The structure is an interdigitated MSM detector fabricated on a silicon membrane. The back surface of the membrane is textured to trap the light within the membrane. This detector provides good absorption at longer wavelengths without sacrificing bandwidth. The membrane is created by reactive ion etching using CF4. The back surface is RIE-textured in an Ar/CF4 mixture. Transmission through a 5 pm membrane was measured to be 7.8%, compared to 30% for an untextured membrane, demonstrating the increased absorption. The MSM detector has a finger width of 2.5 km and a finger spacing of 3.75 pm. The bulk detector prior to membrane creation had a responsivity of 0.24 A/W and an internal quantum efficiency of 80% at 5 V. After membrane fabrication, front illumination of the detectors show a responsivity of 0.17 A/W and an internal quantum efficiency of 60%, compared to 0.21 A/W and 45% for back illumination. The transient response of the detectors was obtained by applying 830 nm optical pulses from a current spiked GaAs laser diode. The transient response of the novel detector at 10 V shows a full-width-half-maximum (FWHM) of 74 ps and a fall time of 128 ps. The -3 dB bandwidth is 3.0 GHz (2.7 GHz at 5 V bias) as determined from the fourier transform of the pulse response. For comparison we measured the detector prior to membrane formation. The pulse response showed a FWHM of 267 ps and a bandwidth of 326 MHz at 10 V bias, which clearly demonstrates the effect of the membrane. In summary we have fabricated a novel high-speed silicon detector which can bc integrated with silicon circuits. The detector can be illuminated from either side of the membrane, It was demonstrated to have a superior bandwidth and similar responsivity at 830 nm compared to previously published silicon MSM detectors [l] measured at 630 nm, despite the much larger absorption length.
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纹理硅膜上的金属-半导体-金属光电二极管
高速和高响应的硅光电探测器,可以很容易地与电子集成,将使硅基光电接收器成为短距离光纤和自由空间光通信的首选技术。然而,硅中的长吸收长度(在830 nm处-10 pm)导致探测器具有较差的高速响应。先前的工作[l-31]侧重于通过减少波长(630 nm处1 pm和400 nm处0.1 pm)来减少吸收长度,尽管光纤衰减在更长的波长处更有利,而光源在830 nm处更容易获得。在本文中,我们提出了一种新的硅金属-半导体-金属(MSM)光电探测器结构,其带宽为3.0 GHz,在830 nm处具有0.17 a /W的直流响应率。制造过程简单,依赖于传统的硅制造工艺。该结构是在硅膜上制作的交错式MSM探测器。膜的背面有纹理,可以将光困在膜内。这种探测器在不牺牲带宽的情况下,在较长的波长上有很好的吸收。膜是用CF4反应离子蚀刻而成的。后表面在Ar/CF4混合物中呈rie纹理。通过5 pm膜的透射率为7.8%,而无纹理膜的透射率为30%,表明吸收增加。MSM探测器的指宽为2.5公里,指间距为3.75 pm。制备膜前的体探测器在5 V时的响应率为0.24 a /W,内部量子效率为80%。制备膜后,探测器正面照明的响应率为0.17 a /W,内部量子效率为60%,而背面照明的响应率为0.21 a /W,内部量子效率为45%。通过施加830 nm的光脉冲,获得了探测器的瞬态响应。新型探测器在10 V时的瞬态响应显示出74 ps的全宽半最大值(FWHM)和128 ps的下降时间,从脉冲响应的傅里叶变换可以确定-3 dB带宽为3.0 GHz (5 V偏置时为2.7 GHz)。为了比较,我们在膜形成之前测量了检测器。在10v偏置下,脉冲响应的FWHM为267 ps,带宽为326 MHz,这清楚地证明了膜的影响。总之,我们制作了一种新型的高速硅探测器,它可以与硅电路集成。该探测器可以从膜的任何一侧照射,与之前发表的630 nm硅MSM探测器[1]相比,它在830 nm处具有优越的带宽和相似的响应率,尽管吸收长度要大得多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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