H. Akahoshi, M. Kawamoto, T. Itabashi, O. Miura, A. Takahashi, S. Kobayashi, M. Miyazaki, T. Mutho, M. Wajima, T. Ishimaru
{"title":"Fine line circuit manufacturing technology with electroless copper plating","authors":"H. Akahoshi, M. Kawamoto, T. Itabashi, O. Miura, A. Takahashi, S. Kobayashi, M. Miyazaki, T. Mutho, M. Wajima, T. Ishimaru","doi":"10.1109/ECTC.1994.367562","DOIUrl":null,"url":null,"abstract":"Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367562","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19
Abstract
Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here.<>
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