Bonded interface properties of Nb direct bonding with Si intermediate layer for 3D interconnection of superconducting devices

Yuta Takahashi, M. Fujino, H. Nakagawa, K. Kikuchi, T. Taino
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Abstract

In this study, Deposited Nb and Si/Nb samples were bonded directly by surface activated bonding method at room temperature. TEM observation of the Nb/Nb interface confirmed an intermediate layer of about 3 nm. A superconducting current of 4–6 mA was observed at 0.3 K in a Si (5 nm) sample deposited on Nb thin film.
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超导器件三维互连中Nb与Si中间层直接键合的键合界面特性
在本研究中,沉积的Nb和Si/Nb样品在室温下采用表面活化键合法直接键合。对Nb/Nb界面的透射电镜观察证实存在约3 nm的中间层。在0.3 K的温度下,在Nb薄膜上沉积的Si (5 nm)样品可获得4 ~ 6 mA的超导电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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