Ion-beam modification of semiconductors

K. Nordlund, S. Kucheyev
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Abstract

In this chapter, we give an overview of the basic physics and experimental method behind the conventional ion-beam modification of semiconductors. In particular, we describe the basic understanding of the keV ion implantation process used for doping Si and the fascinating amount of materials physics involved in the path from the initial implantation to the dopant activation. We also describe two recent developments related to the physics of implantation: the mechanisms of surface ripple formation and time-resolved experiments used to shed new light on defect migration and interaction processes.
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半导体的离子束修饰
在本章中,我们概述了传统离子束修饰半导体背后的基本物理和实验方法。特别是,我们描述了用于掺杂Si的keV离子注入过程的基本理解,以及从初始注入到掺杂激活的路径中涉及的大量材料物理。我们还描述了与注入物理相关的两个最新进展:表面波纹形成的机制和用于揭示缺陷迁移和相互作用过程的时间分辨实验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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Back Matter Characterizing defects with ion beam analysis and channeling techniques Vibrational spectroscopy The role of muons in semiconductor research Ion-beam modification of semiconductors
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