T1: Design for Manufacturability

Y. Zorian, J. Carballo
{"title":"T1: Design for Manufacturability","authors":"Y. Zorian, J. Carballo","doi":"10.1109/ATS.2005.103","DOIUrl":null,"url":null,"abstract":"In addition to designing the functionality, today’s SOC necessitates designing for manufacturability, yield and reliability. Such requirements are fundamentally transforming the current SoC design methodology techniques for enhancing manufacturability, yield and reliability or \"DFX\" to include yield enhancement techniques, resolution enhancement techniques, new or restricted design rules, variability-aware design, and the addition of a special family of embedded IP blocks, called infrastructure IP blocks. The latter blocks are meant to ensure manufacturability of the SoC and to achieve adequate levels of yield and reliability. The infrastructure IP leverages the manufacturing knowledge and feeds back the information into the design phase. This tutorial analyzes the key trends and challenges resulting in manufacturing susceptibility and field reliability that necessitate the use of the above DFX techniques. Then, it concentrates on several examples of each of these techniques.","PeriodicalId":373563,"journal":{"name":"14th Asian Test Symposium (ATS'05)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"14th Asian Test Symposium (ATS'05)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS.2005.103","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

In addition to designing the functionality, today’s SOC necessitates designing for manufacturability, yield and reliability. Such requirements are fundamentally transforming the current SoC design methodology techniques for enhancing manufacturability, yield and reliability or "DFX" to include yield enhancement techniques, resolution enhancement techniques, new or restricted design rules, variability-aware design, and the addition of a special family of embedded IP blocks, called infrastructure IP blocks. The latter blocks are meant to ensure manufacturability of the SoC and to achieve adequate levels of yield and reliability. The infrastructure IP leverages the manufacturing knowledge and feeds back the information into the design phase. This tutorial analyzes the key trends and challenges resulting in manufacturing susceptibility and field reliability that necessitate the use of the above DFX techniques. Then, it concentrates on several examples of each of these techniques.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
T1:可制造性设计
除了设计功能外,今天的SOC还需要设计可制造性,成品率和可靠性。这些要求从根本上改变了当前的SoC设计方法技术,用于提高可制造性,良率和可靠性或“DFX”,包括良率增强技术,分辨率增强技术,新的或受限制的设计规则,可变性感知设计,以及添加特殊系列的嵌入式IP块,称为基础设施IP块。后一个模块旨在确保SoC的可制造性,并达到足够的良率和可靠性水平。基础设施IP利用制造知识并将信息反馈到设计阶段。本教程分析了导致制造敏感性和现场可靠性的关键趋势和挑战,这些趋势和挑战需要使用上述DFX技术。然后,重点介绍每种技术的几个示例。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Efficient Static Compaction Techniques for Sequential Circuits Based on Reverse Order Restoration and Test Relaxation Practical Aspects of Delay Testing for Nanometer Chips State-reuse Test Generation for Progressive Random Access Scan: Solution to Test Power, Application Time and Data Size A Framework for Automatic Assembly Program Generator (A^2PG) for Verification and Testing of Processor Cores Arithmetic Test Strategy for FFT Processor
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1