A three-finger microgripper based on 3D-Assembly

Hao Wu, Liguo Chen, Haibo Huang
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Abstract

Due to force scaling laws, large adhesion forces make the release of microobjects difficult. In order to achieve stable clamping, handling and reliable release of microscale components in micron scale, a three-finger microgripper was developed. The mechanical and dynamic characteristics of the microgripper are analyzed by the finite element software. The gripper is fabricated using a SOI process. Clamping operation is realized by using the electro-thermal-drive. The flat finger and the third finger are assembled into a three-dimensional structure by a micro-assembly method.Test results show the gripper obtained a displacement of 45 $\mu \mathrm{m}$ with an applied voltage of 25 V.Micro-operation experiment was made for the $70\sim 110\mu \mathrm{m}$ microspheres. The cantilever micro-clamping finger can be used to auxiliary handover the release, which can effectively overcome the adhesion between the micro ball and the finger, to achieve reliable release operation.
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一种基于3d装配的三指微夹持器
由于力标度定律,较大的附着力使微物体难以释放。为了实现微米尺度微尺度元件的稳定夹持、搬运和可靠释放,研制了一种三指微夹持器。利用有限元软件对微夹持器的力学特性和动态特性进行了分析。该夹持器采用SOI工艺制造。夹紧操作采用电热驱动实现。通过微组装方法将平指和无名指组装成三维结构。测试结果表明,在施加25 V电压的情况下,夹持器的位移为45 $\mu \mathrm{m}$。对$70\sim 110\mu \mathrm{m}$微球进行了微操作实验。可采用悬臂式微夹指辅助切换释放,可有效克服微球与指间的粘连,实现可靠的释放操作。
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