{"title":"Reactive paste for reflow soldering of large components","authors":"D. Seehase, H. Huth, Arne Neiser, M. Nowottnick","doi":"10.1109/ISSE.2014.6887556","DOIUrl":null,"url":null,"abstract":"For the energetic support of reflow soldering an exothermic reacting paste has been developed. This paste is applied on electronic assemblies adjacent to solder paste deposits before reflow soldering. During the reflow process a chemical reaction inside the paste is releasing energy in the form of heat. This heat is assisting in melting up the solder paste depots, hence allowing the processing of large components at lower peak temperatures. Such created solder joints are analyzed here towards their reliability. Also two examples of employing the reacting paste to aid in the soldering process of large components are given.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887556","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
For the energetic support of reflow soldering an exothermic reacting paste has been developed. This paste is applied on electronic assemblies adjacent to solder paste deposits before reflow soldering. During the reflow process a chemical reaction inside the paste is releasing energy in the form of heat. This heat is assisting in melting up the solder paste depots, hence allowing the processing of large components at lower peak temperatures. Such created solder joints are analyzed here towards their reliability. Also two examples of employing the reacting paste to aid in the soldering process of large components are given.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
