Novel polymer design for ultra-low stress material for advanced packaging applications

Abstract

Multi-RDL architectures in WLP are pushing established materials like polyimide to their limits. Key limitations of these material are high temperature curing and shrinkage which leads to warpage and yield losses. We are developing a dielectric packaging material that has minimal stress upon curing while being compatible with established packaging processes. Another goal is to keep dielectric constant and loss factor as low as possible to ensure compatibility with high frequency applications. Additional feature for this new polymer class is high temperature stability.