Tutorial 6: Enhancing Yield through Design for Manufacturability (DFM)

P. Elakkumanan
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Abstract

Summary form only given. This part of the tutorial will discuss in detail the manufacturing challenges in nanoscale VLSI and consequent design for manufacturability (DFM) approaches by taking a holistic approach in analyzing and addressing different process variability effects. We review the dominant process variations in semiconductor manufacturing process that affect the design yield, show their impact on layout quality, and present currently practiced DFM techniques to mitigate the effect of these variations. We also discuss various manufacturing-aware physical and circuit design methodologies and techniques for parametric yield improvement. This includes correct-by-construction methodologies such as Restricted Design Rules (RDRs) as well as manufacturing aware design approaches. In addition, we will briefly mention some of the many accepted and possible mitigation techniques in design post processing (after tape-out) and will introduce the concept of manufacturing for design (MFD) through design-intent processing.
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教程6:通过可制造性设计(DFM)提高良率
只提供摘要形式。本教程的这一部分将通过采用整体方法分析和解决不同的工艺可变性影响,详细讨论纳米级VLSI和随后的可制造性设计(DFM)方法中的制造挑战。我们回顾了半导体制造过程中影响设计良率的主要工艺变化,展示了它们对布局质量的影响,并介绍了目前实践的DFM技术来减轻这些变化的影响。我们还讨论了各种制造感知的物理和电路设计方法和技术,以提高参数良率。这包括按结构纠正的方法,如受限设计规则(rdr)以及制造感知设计方法。此外,我们将简要地提到一些在设计后处理(贴出后)中被接受的和可能的缓解技术,并将通过设计意图处理介绍为设计而制造(MFD)的概念。
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