Shunsuke Furuse, N. Fujii, Kengo Kotoo, Naoki Ogawa, Taichi Yamada, T. Hirano, S. Saito, Y. Hagimoto, H. Iwamoto
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引用次数: 0
Abstract
In this study, we investigated the relationship between misalignment and bonding strength before and after annealing in the Cu-Cu hybrid bonding process. Before the annealing process, the bonding strength tended to decrease linearly as the misalignment increased. However, we found that this correlation changed after the annealing, seemingly due to thermal expansion in the Cu.
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