A degradation model of aluminum electrolytic capacitors for LED drivers

Bo Sun, Xuejun Fan, C. Yuan, C. Qian, Guoqi Zhang
{"title":"A degradation model of aluminum electrolytic capacitors for LED drivers","authors":"Bo Sun, Xuejun Fan, C. Yuan, C. Qian, Guoqi Zhang","doi":"10.1109/EUROSIME.2015.7103124","DOIUrl":null,"url":null,"abstract":"The failure of aluminum electrolytic capacitors is considered as one of major failure modes of the LED drivers. This paper propose a degradation model of aluminum electrolytic capacitors considers impacts of operation time and temperature.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"261 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2015.7103124","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16

Abstract

The failure of aluminum electrolytic capacitors is considered as one of major failure modes of the LED drivers. This paper propose a degradation model of aluminum electrolytic capacitors considers impacts of operation time and temperature.
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LED驱动器用铝电解电容器的退化模型
铝电解电容器的失效被认为是LED驱动器的主要失效模式之一。提出了考虑工作时间和温度影响的铝电解电容器退化模型。
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