Impact of wet etchant with different PH value on the performance of back-channel-etch a-IGZO thin-film-transistor

Chongyang Ren, Hongjuan Lu, Xiang Xiao, Wei Deng, Yuxiang Xiao, Shengdong Zhang
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Abstract

Aqueous ammonia is used as the new additive to the H2O2-based etchant for back-channel-etch (BCE) amorphous Indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) to pattern Mo source/drain. The Mo residue after being etched by H2O2:NH3·H2O is removed completely by adjusting the PH value to above 7. The BCE a-IGZO TFTs fabricated with the new solution exhibit excellent performances with the field effect mobility of 12.26 cm2V-1s-1, threshold voltage of 0.17 V and sub-threshold swing of 0.24 V/dec when PH value is 9.8. The threshold voltage shift of the device is less than -0.5 V under gate-bias voltage stress of ±30V for 1hour.
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不同PH值的湿式蚀刻剂对反道蚀刻a-IGZO薄膜晶体管性能的影响
将氨水作为h2o2基蚀刻剂的新添加剂,用于反向通道蚀刻(BCE)非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(TFTs)的Mo源/漏刻蚀。通过调节PH值至7以上,H2O2:NH3·H2O蚀刻后的Mo残留物被完全去除。当PH值为9.8时,制备的BCE a-IGZO TFTs的场效应迁移率为12.26 cm2V-1s-1,阈值电压为0.17 V,亚阈值摆幅为0.24 V/dec。在±30V的栅极偏置电压应力下,持续1h,器件的阈值电压位移小于-0.5 V。
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