Challenges in Next Generation Mixed-Signal IC Production Testing

Abstract

This talk will introduce the general challenges faced in high volume production test, and describe how they apply to the testing of the next generation mixed signal ASICs. In general, a test engineer has 4 things he wants to optimize: (1) Test cost, (2) Yield, (3) Time to volume/Time to Market, and (4) Defective-Parts-Per- Million (DPPM) of shipped devices. The relative importance of each of these goals depends on market segment, maturity of the product and a host of other factors. Test cost is minimized by optimizing test time, and by choosing low-cost test platforms. There are also other factors involved in test cost, including burnin requirements and the need for testing at multiple temperatures. Optimization of yield and DPPM often involves improving test reliability to minimize guardbands, as well as ensuring high test coverage. Timeto- volume constraints, often imposed by market requirements, put severe pressure on test engineers to develop reliable low-cost test solutions in minimum time.