Reliability analysis of copper bump interconnection in double-sided power module

Abstract

A high current load may cause the Joule heating, subsequently raising the chip temperature in a conventional power module. Temperature excursion in power chip may generate thermal stress, induce failure and reduce its reliability. Double-sided power module is a crucial structure to provide another heat dissipation path and efficiently reduce chip temperature. This study estimate the thermal and reliability analysis of double-sided power module by using copper bump as an interconnection under different cooling condition. The connection layout can be designed more flexible by using bump interconnection in double-sided power module. The concept of dummy ball also utilized to reduce the mechanical strain or stress of copper bump and improve its reliability in a power module.