A detailed capacitive analysis of symmetric and asymmetric dual-k FinFETs for improved circuit delay metrics

P. Pal, B. Kaushik, S. Dasgupta
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引用次数: 2

Abstract

In the past decade, high permittivity spacer materials has emerged as a potential performance booster in ultra scaled underlap devices to achieve better electrostatic control. However, the enhanced parasitic capacitance inherently associated with high-k materials poses several design challenges that limits its applicability to high-performance (HP) circuits. To improve the overall device performance, symmetric and asymmetric dual-k spacer FinFET architectures had been demonstrated. This paper briefly investigates the effect of the optimized symmetric and asymmetric dual-k structures for better logic circuit performance. This work demonstrates the suitability of high-k spacer materials for high-performance logic circuits improving delay metrics. Compared to the conventional FinFET, symmetric and asymmetric dual-k based inverter speed up the inverter circuit by 32% and 54.4 %, respectively for TiO2 (k=40) spacer materials, even though the total gate capacitance significantly increases by 2.1× and 3.2×, respectively.
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对称和非对称双k finfet的详细电容性分析,以改善电路延迟指标
在过去的十年中,高介电常数间隔材料作为一种潜在的性能增强剂出现在超大规模的下覆器件中,以实现更好的静电控制。然而,与高k材料固有的增强寄生电容带来了几个设计挑战,限制了其在高性能(HP)电路中的适用性。为了提高器件的整体性能,对称和非对称双k间隔片FinFET架构已经被证明。本文简要探讨了优化后的对称和非对称双k结构对提高逻辑电路性能的影响。这项工作证明了高k间隔材料用于高性能逻辑电路的适用性,从而改善了延迟指标。与传统的FinFET相比,采用TiO2 (k=40)间隔材料,对称和非对称双k基逆变器的逆变电路速度分别提高了32%和54.4%,尽管总栅极电容分别显著提高了2.1倍和3.2倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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