On the Use of Assist Circuits for Improved Coupling Fault Detection in SRAMs

Josef Kinseher, L. Zordan, I. Polian
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Abstract

As technology scales down, the density of SRAM devices increases drastically, and their storage capacity grows at the same time. Moreover, SRAMs become more prone to physical defects in each technology node, which therefore increases the need of effective tests with high fault coverage. It has been shown that resistive-bridging defects induce coupling faults that may increase defective parts per million levels if not well covered during manufacturing test. In this work, we study the reuse of read and write assist techniques, commonly applied to improve the functional margins of SRAM core-cells, to improve the coverage of coupling faults. This analysis is based on extensive injection of resistive bridging defects in core-cells of a commercial low-power SRAM. We show that assist circuits can be leveraged to increase the sensitization of defects causing coupling faults by 10-12%, however, they need to be used carefully.
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利用辅助电路改进sram的耦合故障检测
随着技术的发展,SRAM器件的密度急剧增加,其存储容量也随之增加。此外,sram在每个技术节点上更容易出现物理缺陷,因此增加了对高故障覆盖率的有效测试的需求。研究表明,如果在制造测试中没有很好地覆盖,电阻桥接缺陷会引起耦合故障,可能会增加百万分率的次品。在这项工作中,我们研究了读写辅助技术的重用,这些技术通常用于改善SRAM核心单元的功能边界,以提高耦合故障的覆盖率。这一分析是基于在商业低功耗SRAM的核心单元中广泛注入电阻桥接缺陷。我们表明,辅助电路可以被利用来增加10-12%的缺陷引起的耦合故障的敏化,但是,他们需要小心使用。
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