K. Petroz, E. Ollier, H. Grateau, J. Bechtle, P. Labeye, P. Mottier
{"title":"A fully integrated micro-opto-mechanical steering device","authors":"K. Petroz, E. Ollier, H. Grateau, J. Bechtle, P. Labeye, P. Mottier","doi":"10.1109/MEMSYS.1998.659737","DOIUrl":null,"url":null,"abstract":"We present a wholly integrated one dimensional scanner, for telemetry and obstacle detection applications. The deflection is obtained by means of cylindrical microlenses, driven by a set of electrostatic combs. Integrated on silicon substrate, the steering device is etched in silica to widen the operation wavelength range. The chosen design and associated silicon surface micromachining technology enable more than 700 chips to be produced on a 100 mm diameter wafer. Furthermore, we underline the simplicity of the process as the optical axis and mechanical structure move in the substrate plane. This paper describes the structure, manufacturing process flow and experimental results of the developed 1D-scanner.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1998.659737","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We present a wholly integrated one dimensional scanner, for telemetry and obstacle detection applications. The deflection is obtained by means of cylindrical microlenses, driven by a set of electrostatic combs. Integrated on silicon substrate, the steering device is etched in silica to widen the operation wavelength range. The chosen design and associated silicon surface micromachining technology enable more than 700 chips to be produced on a 100 mm diameter wafer. Furthermore, we underline the simplicity of the process as the optical axis and mechanical structure move in the substrate plane. This paper describes the structure, manufacturing process flow and experimental results of the developed 1D-scanner.