Electrical pumping to III-V layer from highly doped silicon micro wire to realize light emission by plasmaassisted bonding technology

Linghan Li, R. Takigawa, A. Higo, E. Higurashi, M. Sugiyama, Y. Nakano
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引用次数: 3

Abstract

The direct current pumping from highly doped silicon microwire to InP-based III-V active layer for spontaneous light emission was realized by air ambient plasma-assisted direct bonding. The semi-conductive properties of the hetero-integration and the effects of plasma-assisted bonding process on InGaAsP multiple quantum well (MQW) were measured and discussed. The electrical pumping from silicon microwire to InGaAsP MQW material for spontaneous light emission was successfully demonstrated afterwards.
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利用等离子体辅助键合技术,将高掺杂硅微丝电泵送到III-V层实现发光
采用空气环境等离子体辅助直接键合的方法,实现了高掺杂硅微线向inp基III-V型有源层的直流抽运,实现了自发光发射。测量并讨论了异质积分的半导体性能以及等离子体辅助键合过程对InGaAsP多量子阱(MQW)的影响。随后成功地演示了从硅微丝到InGaAsP MQW材料的自发光泵浦。
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