Electrical and Morphological Investigations of Electrical Contacts used in Low-Voltage Circuit-Breakers

Marion Kubler-Riedinger, J. Bauchire, D. Hong, G. Déplaude, P. Joyeux
{"title":"Electrical and Morphological Investigations of Electrical Contacts used in Low-Voltage Circuit-Breakers","authors":"Marion Kubler-Riedinger, J. Bauchire, D. Hong, G. Déplaude, P. Joyeux","doi":"10.1109/HLM49214.2020.9307843","DOIUrl":null,"url":null,"abstract":"The contact point in modular protective devices is the place where the current lines are concentrated. This phenomenon leads to the contact point heating or even melting, with a risk of sticking. Sticking can prevent the product from opening if the opening force is not sufficient to detach the contacts, causing serious damage to the electrical installation and to persons. It is therefore essential to avoid any welding of the contacts. That is why a test bench was designed and built in order to determine the temperature rise and the conditions leading to static melting. The current used had a waveform and an amplitude similar to that of the short-circuit current.This paper presents electrical measurements coupled with microscopic measurements of contact surfaces: 3D optical imaging (x500), and electron imaging (x150 to 2000) for surface topology and chemical distribution. This allowed us to better interpret the electrical behavior of the contact point. Investigations were performed according to several parameters: current amplitude passing through the contact point and contact force preset via a spring. Based on the results, the influence of these parameters on the contact voltage and on the state of the contact surface was characterized.","PeriodicalId":268345,"journal":{"name":"2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HLM49214.2020.9307843","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

The contact point in modular protective devices is the place where the current lines are concentrated. This phenomenon leads to the contact point heating or even melting, with a risk of sticking. Sticking can prevent the product from opening if the opening force is not sufficient to detach the contacts, causing serious damage to the electrical installation and to persons. It is therefore essential to avoid any welding of the contacts. That is why a test bench was designed and built in order to determine the temperature rise and the conditions leading to static melting. The current used had a waveform and an amplitude similar to that of the short-circuit current.This paper presents electrical measurements coupled with microscopic measurements of contact surfaces: 3D optical imaging (x500), and electron imaging (x150 to 2000) for surface topology and chemical distribution. This allowed us to better interpret the electrical behavior of the contact point. Investigations were performed according to several parameters: current amplitude passing through the contact point and contact force preset via a spring. Based on the results, the influence of these parameters on the contact voltage and on the state of the contact surface was characterized.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
低压断路器电触点的电学和形态学研究
模块化保护装置中的接触点是电流线路集中的地方。这种现象导致接触点发热甚至熔化,有粘着的危险。如果打开力不足以使触点分离,则粘接会使产品无法打开,对电气装置和人员造成严重损害。因此,必须避免触点的任何焊接。这就是为什么要设计和建造一个试验台,以确定温度上升和导致静态熔化的条件。所使用的电流具有与短路电流相似的波形和幅度。本文介绍了电测量与接触表面的微观测量相结合:三维光学成像(x500)和电子成像(x150至2000),用于表面拓扑和化学分布。这使我们能够更好地解释接触点的电气行为。根据几个参数进行了研究:通过接触点的电流振幅和通过弹簧预设的接触力。在此基础上,表征了这些参数对接触电压和接触面状态的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
The Relationship between Contact Resistance and Roughness (Sq) of a Bi-layered Surface using a Finite Element Model Experimental Investigation of Alternating Current Arc Behavior and Associated Contact Welding Failure for General-purpose Relay Impact of the Ball Grid Array Connection Failures on Signal Integrity HLM 2020 Commmittees 3D Simulation of Electric Arcing and Pressure increase in an Automotive HVDC Relay During a Short Circuit Situation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1