Effects of heating factors on the geometry size of unrestricted lead-free joints

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI:10.1109/AGEC.2004.1290874

Wu Feng-shun, Chen Li, Wu Boyi, Wu Yiping

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引用次数: 4

Abstract

In this paper, the effects of heating factor on the geometry size of unrestricted lead-free joints were investigated. The morphologies of IMC formed in the joint were studied in detail by using SEM and EDX. When the Sn3.5Ag0.5Cu solder joint was formed in unrestricted condition, the width of the joint and the mean thickness of interfacial IMC increased with the increase of heating factor. The volume of the joint was larger than the volume of the Sn3.5Ag0.5Cu solder, but the effects of heating factor on the change of volume were undulate. The morphologies of the interfacial IMC were needle-like when heating factor was small, and then, grew, coarsened when heating factor increased. The tensile fractography of the joint indicated that the morphologies of IMC at fracture surface were various. Some of IMCs shaped like pyramid, and some of IMCs shaped like needle. And part of the fracture surface located in the solder, and part of the fracture surface located at the interface between the interfacial IMC and solder.

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加热因素对无限制无铅接头几何尺寸的影响

研究了加热系数对无限制无铅接头几何尺寸的影响。利用扫描电镜(SEM)和x射线衍射(EDX)对接头中形成的IMC的形貌进行了详细研究。在不受限制条件下形成Sn3.5Ag0.5Cu焊点时，随着加热因子的增加，焊点宽度和界面IMC的平均厚度增加。接头体积大于Sn3.5Ag0.5Cu钎料体积，但加热因素对接头体积变化的影响呈波动状。升温因子较小时，界面IMC形貌呈针状，升温因子增大后，界面IMC形貌逐渐变粗、变粗。接头的拉伸断口形貌表明，IMC在断口处形态多样。有些imc的形状像金字塔，有些imc的形状像针。其中部分断裂面位于焊料中，部分断裂面位于界面IMC与焊料之间的界面处。

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2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

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