{"title":"The Components Layout Optimization of Circuit Module Based on the Artificial Nerve Network","authors":"H. Huang, De-jian Zhou, Zhaohua Wu","doi":"10.1109/ICEPT.2007.4441388","DOIUrl":null,"url":null,"abstract":"In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"236 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441388","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.
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