Adaptive control of wafer temperature in RTP

J. Choi, H. Do, Hong-Seok Choi
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Abstract

This paper presents a wafer temperature control method in RTP using a stable nonparametric adaptive control approach based on a neural network referred to as a piecewise linear approximation network (PLAN). Numerous studies have addressed the RTP temperature control problem and most research on this problem require exact knowledge of the system dynamics. Most approaches do not guarantee the desired performance in practical application when there exist some modeling errors between the model and the actual system or the system dynamics are time-varying. In this paper, a stable nonparametric adaptive control scheme is applied to RTP without an exact information on the dynamics. The system dynamics are assumed to be an affine nonlinear form, i.e., x/spl dot/=f(x)+g(x)u, and the unknown portion of the dynamics are estimated by PLAN. The controller architecture is based on adaptive feedback linearization. The performance of the proposed control approach is validated through experiments on the RTP system developed by Kornic Systems Corporation in Korea.
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RTP晶圆温度的自适应控制
本文提出了一种基于分段线性逼近网络(PLAN)的稳定非参数自适应控制方法在RTP中的晶圆温度控制方法。许多研究已经解决了RTP温度控制问题,大多数研究都需要精确的系统动力学知识。在实际应用中,当模型与实际系统存在一定的建模误差或系统动力学具有时变特性时,大多数方法都不能保证达到预期的性能。本文将一种稳定的非参数自适应控制方法应用于不需要精确动力学信息的RTP系统。假设系统动力学为仿射非线性形式,即x/spl点/=f(x)+g(x)u,并通过PLAN估计动力学的未知部分。控制器结构基于自适应反馈线性化。通过在韩国Kornic系统公司开发的RTP系统上的实验,验证了所提出的控制方法的性能。
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