J. Lester, M. Ahmadi, S. Peratoner, J. Hathaway, D. Garske, P. Chow
{"title":"Low cost miniaturized EHF SATCOM transceiver featuring HEMT MMICs and LTCC multilayer packaging","authors":"J. Lester, M. Ahmadi, S. Peratoner, J. Hathaway, D. Garske, P. Chow","doi":"10.1109/MCS.1995.470996","DOIUrl":null,"url":null,"abstract":"The authors present a 20 GHz downconverter and a 44 GHz upconverter for a low cost miniaturized transceiver for EHF SATCOM terminal applications. The hardware features a set of passivated pseudomorphic InGaAs HEMT MMICs including a 20 GHz balanced low noise amplifier and a 44 GHz 100 mW driver amplifier. The upconverter input and the LO input of the downconverter feature built-in-test (BIT) with on-chip detectors. The downconverter is packaged in a low temperature co-fired ceramic (LTCC) substrate, with integrated RF and DC interconnects, printed resistors, and a buried stripline IF filter.<<ETX>>","PeriodicalId":325779,"journal":{"name":"IEEE 1995 Microwave and Millimeter-Wave. Monolithic Circuits Symposium. Digest of Papers","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 1995 Microwave and Millimeter-Wave. Monolithic Circuits Symposium. Digest of Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCS.1995.470996","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The authors present a 20 GHz downconverter and a 44 GHz upconverter for a low cost miniaturized transceiver for EHF SATCOM terminal applications. The hardware features a set of passivated pseudomorphic InGaAs HEMT MMICs including a 20 GHz balanced low noise amplifier and a 44 GHz 100 mW driver amplifier. The upconverter input and the LO input of the downconverter feature built-in-test (BIT) with on-chip detectors. The downconverter is packaged in a low temperature co-fired ceramic (LTCC) substrate, with integrated RF and DC interconnects, printed resistors, and a buried stripline IF filter.<>
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