Determination of yield bounds prior to routing

Arunshankar Venkataraman, I. Koren
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引用次数: 12

Abstract

Integrated circuit manufacturing complexities have resulted in decreasing product yields and reliabilities. This process has been accelerated with the advent of very deep sub-micron technologies coupled with the introduction of newer materials and technologies like copper interconnects, silicon-on-insulator and increased wafer sizes. The need to improve product yields has been recognized and currently some yield enhancement techniques are used in industry CAD tools. Still, the significant increase in problem size implies that considerable time and effort can be saved if the designer could predict the yield of each design stage. In this paper we undertake an effort to derive bounds on the yield of the routing for a given placement. When the design is routed, resulting in a yield which is significantly smaller than the bound, the designer can choose to change the router cost functions, modify the placement or even re-design the unit in an attempt to increase the yield. We compare the bounds on yield obtained for a set of standard benchmarks against exact yield values for the "vanilla" routings, and the run times needed to calculate the two. The results indicate that reasonably good estimates of yield can be obtained in significantly lower amounts of run time. The accuracy of the estimates increases when larger designs are considered as the simplifying assumptions made and the model no longer influences the estimates significantly.
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在路由之前确定产量界限
集成电路制造的复杂性导致了产品产量和可靠性的下降。随着深亚微米技术的出现,再加上铜互连、绝缘体上硅和晶圆尺寸增加等新材料和技术的引入,这一过程得到了加速。提高产品良率的需要已经被认识到,目前在工业CAD工具中使用了一些良率提高技术。尽管如此,问题规模的显著增加意味着,如果设计人员能够预测每个设计阶段的产出,就可以节省大量的时间和精力。在本文中,我们致力于推导给定位置的路由的产率的界。当设计路由时,导致良率明显小于边界时,设计者可以选择改变路由器成本函数,修改放置甚至重新设计单元以试图提高良率。我们将一组标准基准测试获得的产率界限与“普通”路由的确切产率值进行比较,并计算两者所需的运行时间。结果表明,可以在显著较低的运行时间内获得相当好的产量估计。当更大的设计被认为是简化的假设,模型不再显著影响估计时,估计的准确性会提高。
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