A Systematic Study and Lifetime Modeling on the Board Level Reliability of SSD after Temperature Cycling Test

Choongpyo Jeon, Youngsung Choi, K. Rhew, Jinsoo Bae, Yeungjung Cho, S. Pae
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引用次数: 1

Abstract

Solid state drive (SSD) is widely used for modern computing systems. As design of systems becomes more complex, concern for thermal fatigue lifetime has enlarged by increasing thermo-mechanical stress. Thermal cycling test (TCT) is the most common and important reliability item to determine solder joint reliability. The differences between the TCT conditions at component manufacturer's sites and the user environment, however, can cause a change in fatigue lifetime and failure location because of the difference in mechanical load condition such as housing, connector, screw and so on. For that reason, a proper test method is required reflecting various environmental and field conditions. This paper proposes a novel TCT method that is designed in considering the mounted condition of M.2 next generation form factor (NGFF) SSD. The reliability assessment was conducted in two temperature range and loading conditions, and the test results were analyzed on a SSD level test equipment and a test program. Test result show acceleration relationship is verified by temperature acceleration. Test jig reflecting real use environment was manufactured to verify the differences between the loading conditions. In the case of mounting SSD to test jig, Weibull characteristic parameters were degraded. Test results show shape parameter is decreased from 6.25 to 2.02, and 10 percent life is also decreased 60.7 percent with SSD mounting condition. Failure location was changed from solder on NAND side to solder between DRAM and controller side according to the loading condition. This implies that it is completely different reliability assessment depending on whether the jig is applied or not. Failure analysis was conducted by cross section analysis method. Finite element analysis (FEA) was conducted to understand the failure location and stress level changes caused by test conditions. These results are verified by strain measurement of each location. The strain rate of the point of DRAM and controller side was increased by approximately 20 percent due to applying test jig, and the increase in strain rate leads to an initial lifetime deterioration. This work provides the results of the impact of loading conditions under TCT of M.2 SSD. In conclusion, the cause of reliability characteristics degradation and failure location change derived from the difference in loading conditions of M.2 SSD is investigated, and more accurate modeling and evaluation methodology for predicting product level reliability characteristics are introduced. Thus, SSD level reliability test design reflecting a condition mounted on end-products is needed to verify more accurate reliability prediction.
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温度循环试验后SSD板级可靠性的系统研究与寿命建模
固态硬盘(SSD)广泛应用于现代计算系统。随着系统设计的复杂化,热机械应力的增加,热疲劳寿命的问题日益受到关注。热循环试验(TCT)是确定焊点可靠性的最常见也是最重要的可靠性项目。然而,由于部件制造商现场的TCT条件与用户环境的差异,由于外壳、连接器、螺钉等机械载荷条件的差异,可能会导致疲劳寿命和失效位置的变化。因此,需要一种适当的测试方法来反映各种环境和现场条件。针对M.2下一代外形因数(NGFF)固态硬盘的安装条件,提出了一种新的TCT方法。在两种温度范围和加载条件下进行了可靠性评估,并在SSD级测试设备和测试程序上对测试结果进行了分析。试验结果表明,温度加速度与加速度之间的关系得到了验证。制作了反映实际使用环境的试验夹具,验证了载荷条件之间的差异。在安装SSD到测试夹具的情况下,威布尔特征参数降低。测试结果表明,在SSD安装条件下,形状参数从6.25降低到2.02,10%的寿命也降低了60.7%。根据负载情况,将故障位置从NAND侧的焊点更改为DRAM与控制器侧的焊点。这意味着它是完全不同的可靠性评估取决于是否应用夹具。采用截面分析法进行失效分析。通过有限元分析(FEA)了解试验条件导致的破坏位置和应力水平变化。这些结果通过每个位置的应变测量得到验证。由于使用测试夹具,DRAM和控制器侧点的应变率增加了约20%,应变率的增加导致了初始寿命的恶化。本文给出了M.2固态硬盘TCT下加载条件的影响结果。最后,研究了M.2固态硬盘加载条件差异导致可靠性特性退化和失效位置变化的原因,提出了更准确的产品级可靠性特性预测建模和评估方法。因此,为了验证更准确的可靠性预测,需要设计反映最终产品安装状态的SSD级可靠性测试。
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