{"title":"A highly integrated two channel MMIC down converter with gain control","authors":"J. Staudinger, W. Seely, J.M. Golio, B. Beckwith","doi":"10.1109/MCS.1990.110927","DOIUrl":null,"url":null,"abstract":"A complete MMIC (monolithic microwave IC) down converter with variable-gain control has been fabricated. A 6-8-GHz RF input signal is converted using a fixed 10-GHz LO (local oscillator), to a two-channel 2-4-GHz IF. The die is highly integrated, including an RF preamplifier, a double-balanced mixer, an LO amplifier, a power divider, IF amplification, and two voltage-controlled IF amplifiers which provide variable-gain adjustment. Back vias are utilized to establish grounding for both DC and RF. Probe pads are also included for measuring chip-level performance. A circuit description, the design techniques, and measured performance results are presented.<<ETX>>","PeriodicalId":388492,"journal":{"name":"IEEE Symposium on Microwave and Millimeter-Wave Monolithic Circuits","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Symposium on Microwave and Millimeter-Wave Monolithic Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCS.1990.110927","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A complete MMIC (monolithic microwave IC) down converter with variable-gain control has been fabricated. A 6-8-GHz RF input signal is converted using a fixed 10-GHz LO (local oscillator), to a two-channel 2-4-GHz IF. The die is highly integrated, including an RF preamplifier, a double-balanced mixer, an LO amplifier, a power divider, IF amplification, and two voltage-controlled IF amplifiers which provide variable-gain adjustment. Back vias are utilized to establish grounding for both DC and RF. Probe pads are also included for measuring chip-level performance. A circuit description, the design techniques, and measured performance results are presented.<>
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