Application of air cooled microchannel heat exchangers to card cage systems

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 1993-02-02 DOI:10.1109/STHERM.1993.225331

R. Nelson, T. Dolbear, K. Chen, C. Chao

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引用次数: 7

Abstract

An application of a novel-geometry, air-cooled, microchannel heat exchanger for electronic chips reported by C. Hilbert et al. (1990) is described. These heat exchangers, based on narrow channels and laminar flow, are scaled to cool large packets, mated to high-power pin grid arrays (PGAs) or multichip modules (MCMs), and mounted on printed circuit boards in a card cage. The heat exchanger reported fits within the package footprint and meets chip temperature specifications to 50 W. The system provides cooling for two MCM or PGA boards, each carrying eight 35-W modules using the scaled design. The modules were mounted on a printed wiring board, along with conventional components dissipating an additional 100 W. Chip temperature rises within the packages were kept to 50 degrees C above ambient. The entire card cage contained the two MCM or PGA boards and several other conventionally cooled boards. Fan placement and air flow design were conventional except for the provision of ducting above the high-power packages. The heat exchangers operate at a very low pressure loss, allowing the MCM section to be cooled with two common axial flow fans while generating acoustic noise within the range acceptable for office equipment.<>

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风冷式微通道换热器在卡笼系统中的应用

本文描述了C. Hilbert等人(1990)报道的一种新型几何形状、风冷式微通道热交换器在电子芯片上的应用。这些热交换器基于窄通道和层流，可用于冷却大型数据包，与高功率引脚网格阵列(pga)或多芯片模块(mcm)配合使用，并安装在卡笼中的印刷电路板上。报告的热交换器符合封装尺寸，并满足芯片温度规格至50 W。该系统为两个MCM或PGA板提供冷却，每个板携带8个采用缩放设计的35w模块。这些模块被安装在一个印刷布线板上，与传统的组件一起消耗额外的100w。封装内的芯片温度升高保持在高于环境温度50摄氏度。整个卡笼包含两个MCM或PGA板和几个其他传统冷却板。风扇的位置和气流设计是常规的，除了在大功率组件上方提供导管。热交换器在非常低的压力损失下工作，允许MCM部分用两个普通轴流风扇冷却，同时产生的噪声在办公设备可接受的范围内。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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