{"title":"Photonics — Electronics integration on CMOS","authors":"L. Fulbert, J. Fédéli","doi":"10.1109/ESSCIRC.2011.6044908","DOIUrl":null,"url":null,"abstract":"Silicon photonics has generated an outstanding interest for optical communications and for inter and intra-chip interconnects in electronic systems. High performance generic building blocks that can be used for a broad range of applications have already been demonstrated such as waveguides, I/O couplers, laser sources by III-V/Si heterogeneous integration, fast silicon modulators and germanium photodetectors. The paper will also review the different scenarios for integrating photonic functions with an electronic circuit, as well as the associated design, test and packaging challenges.","PeriodicalId":161896,"journal":{"name":"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2011.6044908","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Silicon photonics has generated an outstanding interest for optical communications and for inter and intra-chip interconnects in electronic systems. High performance generic building blocks that can be used for a broad range of applications have already been demonstrated such as waveguides, I/O couplers, laser sources by III-V/Si heterogeneous integration, fast silicon modulators and germanium photodetectors. The paper will also review the different scenarios for integrating photonic functions with an electronic circuit, as well as the associated design, test and packaging challenges.