{"title":"A unified multi-axial sub-micron fatigue tester with applications to electronic packaging materials","authors":"Minfu Lu, W. Ren, Sheng Liu, D. Shangguan","doi":"10.1109/ECTC.1997.606159","DOIUrl":null,"url":null,"abstract":"A recently developed multi-axial sub-micron thermomechanical fatigue tester has been used for investigating the behaviors of small specimens, particularly in the field of electronic packaging materials and structures. Materials tested include a copper wire, polycarbonate and polyimide films and a lead-free solder alloy. An active alignment monitoring and adjustment has been found to be important for realistic characteristics of tiny points.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606159","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
A recently developed multi-axial sub-micron thermomechanical fatigue tester has been used for investigating the behaviors of small specimens, particularly in the field of electronic packaging materials and structures. Materials tested include a copper wire, polycarbonate and polyimide films and a lead-free solder alloy. An active alignment monitoring and adjustment has been found to be important for realistic characteristics of tiny points.
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