Plasma mode influences on the surface hydrophobization of polyimide

Letao Zhang, Hongyang Zuo, Qian Ma, Shengdong Zhang, Liangfen Zhang, Xiao-xing Zhang, Y. Hsu
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引用次数: 1

Abstract

Polyimide (PI) based photo-resistance films were treated by different CF4 plasma modes to serve as a bank material for inkjet printing OLED. The original PI film shows a moderate hydrophobicity with a 23.8° contact angle for PGMEA. However, the surface of PI film will become hydrophobic after treated by CF4 plasma with PE mode. In contrast, CF4 plasma with etch mode is apt to form a hydrophilic PI surface because of the ion bombardment.
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等离子体模式对聚酰亚胺表面疏水性的影响
采用不同的CF4等离子体模式处理聚酰亚胺(PI)基光阻薄膜,作为喷墨打印OLED的银行材料。原始PI膜具有中等疏水性,对PGMEA具有23.8°的接触角。而CF4等离子体经PE模式处理后,PI膜表面会出现疏水现象。相比之下,具有蚀刻模式的CF4等离子体由于离子轰击而易于形成亲水性PI表面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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