3D simulation of electrical characteristic fluctuation induced by interface traps at Si/high-к oxide interface and random dopants in 16-nm-Gate CMOS devices

Hui-Wen Cheng, Y. Chiu, Yiming Li
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引用次数: 2

Abstract

The random dopant (RD)-induced threshold voltage fluctuation (σVth) was explored recently [1–4]. RD fluctuation (RDF) has been one of challenges in nano-CMOS technologies; consequently, high-к/metal gate (HKMG) approach is adopted to suppress intrinsic parameter fluctuation and leakage current for sub-45-nm generations. However, random interface traps (ITs) appearing at Si/high-к oxide interface results in a new fluctuation source [2]. Effects of ITs and RDs on electrical characteristic fluctuation have not been explored yet. In this work, we study influences of random ITs and RDs on 16-nm CMOS devices using an experimentally calibrated 3D device simulation [1–4]. Devices with totally random ITs, RDs, and “ITs+RDs” (i.e., 3D device simulation with considering random ITs and RDs simultaneously) are generated and simulated to assess the device variability.
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16nm栅极CMOS器件中Si/高氧化硅界面陷阱和随机掺杂引起的电特性波动的三维模拟
随机掺杂剂(RD)诱导的阈值电压波动(σVth)是近年来研究的热点[1-4]。RD波动(RDF)一直是纳米cmos技术面临的挑战之一。因此,采用高通量/金属栅极(HKMG)方法抑制45 nm以下世代的固有参数波动和漏电流。然而,在Si/高氧界面上出现的随机界面陷阱(ITs)导致了新的波动源[2]。ITs和RDs对电特性波动的影响尚未探讨。在这项工作中,我们通过实验校准的3D器件模拟研究了随机ITs和rd对16纳米CMOS器件的影响[1-4]。生成并模拟具有完全随机ITs、rd和“ITs+ rd”(即同时考虑随机ITs和rd的3D设备模拟)的设备,以评估设备可变性。
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