{"title":"The effect of polyimide fixation on thermal performance of GaAs cantilever based MEMS: a 3D numerical analysis with DEETEN","authors":"E. Burian, T. Lalinsky","doi":"10.1109/ASDAM.2002.1088464","DOIUrl":null,"url":null,"abstract":"We refer of novel simulation technology DEETEN based on spatial domain decomposition, capable of efficient multi-million-point 3D simulations on a conventional PC The technology has been successfully applied to 3D thermal analysis of a GaAs Micromechanical Thermal Converter microsystem.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"121 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.2002.1088464","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We refer of novel simulation technology DEETEN based on spatial domain decomposition, capable of efficient multi-million-point 3D simulations on a conventional PC The technology has been successfully applied to 3D thermal analysis of a GaAs Micromechanical Thermal Converter microsystem.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
