Effect of tensile capping layer on 3-D stress profiles in FinFET channels

K. Shin, T. Lauderdale, T. King
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引用次数: 8

Abstract

Strained-silicon technologies have been widely investigated to enhance the performance of CMOS devices (Thompson, et. al., 2005). In particular, strain induced by the use of a stressed SiNx capping layer is advantageous because of its process simplicity and its extendibility from bulk-Si to silicon-on-insulator (SOI) MOSFETs (Komoda, 2004, Pidin, 2004). In this paper, the effect of a tensile capping layer on the stress profile in the channel of a FinFET is studied for different channel-surface crystalline orientations and different fin aspect ratios, using the Ansys5.7 simulator
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拉伸封盖层对FinFET通道三维应力分布的影响
应变硅技术已被广泛研究,以提高CMOS器件的性能(Thompson等,2005)。特别是,使用应力SiNx封盖层引起的应变是有利的,因为它的工艺简单,并且从体硅到绝缘体上硅(SOI) mosfet的可扩展性(Komoda, 2004, Pidin, 2004)。本文利用Ansys5.7仿真器,研究了不同通道表面晶向和不同翅片长径比下,拉伸封盖层对FinFET通道内应力分布的影响
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