The effect of softbaking temperature on SU-8 photoresist performance

Abstract

One of the steps required during the fabrication of SU-8 mold for soft lithography is softbaking, which is conducted after the deposition of the photoresist. The purpose of softbaking is to stabilize the resist film and eliminate any remaining solvent through evaporation. This ensures that the resist surface is non-sticking, hence avoiding debris when transferring the patterns later. In this paper, we investigate the effects of softbaking temperature on the polymerization of SU-8 photoresist. The significance of this work is to optimize the fabrication process involved in producing SU-8 mold structures with thickness of 30 μm. This project involves a series of experiments covering softbaking temperatures ranging from 45° to 115° C. Experiments results show that softbaking temperature of 85°C results in completely stick and crack free structures. By this, a huge improvement obtained if compared to the result of processing at the standard soft bake temperature of 95°C. The soft bake temperature should not be taken lightly while optimizing SU-8 processing because it has a big influence on the material properties and the lithographic performance of the resist.