HBIST: An approach towards zero external test cost

M. Bubna, K. Roy, A. Goel
{"title":"HBIST: An approach towards zero external test cost","authors":"M. Bubna, K. Roy, A. Goel","doi":"10.1109/VTS.2012.6231073","DOIUrl":null,"url":null,"abstract":"Test cost is increasingly becoming a major component of a product's design cost in scaled technologies. Exponential increase in test data volumes for sub-45 designs, especially for testing delay faults has led to large increase in ATE cost and test application time. In order to reduce external test cost, Logic BIST has been explored as a possible alternative to manufacturing test [1-5]. However, this paper shows that a large number of faults in BIST logic of large IWLS'05 and ITC'99 benchmark processors remain undetected after BIST run (42% of stuck-at and 34% of transition faults on average) and thus, BIST logic needs to be tested properly. This paper proposes a hierarchical BIST methodology `HBIST' which uses different BIST techniques to obtain complete stuck-at and transition fault coverage of CUT and then introduces additional levels of BIST logic to test for faults in the BIST logic at the preceding levels. A design methodology is proposed to optimize the number of additional levels of BIST required while keeping the BIST area and power overhead, and the addition of extra faults in BIST logic minimal. Experiments on large benchmarks show an average of 95.9% CUT stuck-at fault coverage (ATPG coverage of 96.4%) and 93.5% CUT transition fault coverage (ATPG coverage of 95.3%) is obtained using HBIST. Also, up to 99.2% (average 93.2%) reduction in external ATE test cost (including cost needed to test additional BIST levels) is obtained using two levels of BIST at 7% average area overhead (compared to scan overhead of 38.2%) and 18% increase in test power.","PeriodicalId":169611,"journal":{"name":"2012 IEEE 30th VLSI Test Symposium (VTS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 30th VLSI Test Symposium (VTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTS.2012.6231073","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Test cost is increasingly becoming a major component of a product's design cost in scaled technologies. Exponential increase in test data volumes for sub-45 designs, especially for testing delay faults has led to large increase in ATE cost and test application time. In order to reduce external test cost, Logic BIST has been explored as a possible alternative to manufacturing test [1-5]. However, this paper shows that a large number of faults in BIST logic of large IWLS'05 and ITC'99 benchmark processors remain undetected after BIST run (42% of stuck-at and 34% of transition faults on average) and thus, BIST logic needs to be tested properly. This paper proposes a hierarchical BIST methodology `HBIST' which uses different BIST techniques to obtain complete stuck-at and transition fault coverage of CUT and then introduces additional levels of BIST logic to test for faults in the BIST logic at the preceding levels. A design methodology is proposed to optimize the number of additional levels of BIST required while keeping the BIST area and power overhead, and the addition of extra faults in BIST logic minimal. Experiments on large benchmarks show an average of 95.9% CUT stuck-at fault coverage (ATPG coverage of 96.4%) and 93.5% CUT transition fault coverage (ATPG coverage of 95.3%) is obtained using HBIST. Also, up to 99.2% (average 93.2%) reduction in external ATE test cost (including cost needed to test additional BIST levels) is obtained using two levels of BIST at 7% average area overhead (compared to scan overhead of 38.2%) and 18% increase in test power.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
HBIST:实现零外部测试成本的方法
在规模化技术中,测试成本日益成为产品设计成本的重要组成部分。sub-45设计的测试数据量呈指数级增长,特别是测试延迟故障,导致ATE成本和测试应用时间大幅增加。为了降低外部测试成本,已经探索了逻辑BIST作为制造测试的可能替代方案[1-5]。然而,本文表明,在大型IWLS'05和ITC'99基准处理器的BIST逻辑中,大量故障在BIST运行后仍未被检测到(平均42%的卡滞故障和34%的转换故障),因此,需要对BIST逻辑进行适当的测试。本文提出了一种分层的BIST方法“HBIST”,该方法使用不同的BIST技术来获得CUT的完全卡住和转换故障覆盖,然后引入额外的BIST逻辑级别来测试前一层BIST逻辑中的故障。提出了一种设计方法,以优化所需的BIST附加层的数量,同时保持BIST的面积和功率开销,并在BIST逻辑中添加最小的额外故障。大型基准实验表明,使用HBIST平均获得95.9%的CUT卡故障覆盖率(ATPG覆盖率为96.4%)和93.5%的CUT过渡故障覆盖率(ATPG覆盖率为95.3%)。此外,使用两级BIST,平均面积开销为7%(扫描开销为38.2%),测试功率增加18%,外部ATE测试成本(包括测试额外BIST级别所需的成本)降低了99.2%(平均为93.2%)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Derating based hardware optimizations in soft error tolerant designs Exploiting X-correlation in output compression via superset X-canceling SAT-ATPG using preferences for improved detection of complex defect mechanisms Smart selection of indirect parameters for DC-based alternate RF IC testing Write-through method for embedded memory with compression Scan-based testing
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1