Simulation and testing of temperature distribution and resistance versus power for SWEAT and related Joule-heated metal-on-insulator structures

Abstract

Standard wafer-level electromigration acceleration test (SWEAT) structures show a critical current for imminent thermal runaway for good metal films even within a linear resistance-versus-power relationship. Consideration of heat sinking and lateral thermal conduction along the metal gives a better knowledge of the origin of this critical current. This permits greater speed and stability of control in testing Joule-heated electromigration (SWEAT) structures, as well as improved understanding of the temperature profile associated with a given fractional resistance change during the accelerated life testing.<>