Beyond the qualified manufacturer list (QML)

E. Hakim, C. Rust, W. Olsson
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引用次数: 1

Abstract

The Microcircuit Application Handbook, MIL-HDBK-179(ER), dated 25 October 1993 is becoming the Army guide for the determination of suitability of a microcircuit packaging approach and the selection criteria for microcircuit suppliers and part types. This document is based on recommendations provided by the DoD Defense Science Board. A multiple entry matrix lists all possible DoD equipment environments, which ranges from temperature humidity controlled to space. Parts for these application environments include commercial and industrial grade plastic encapsulated microcircuits (PEMs), industrial qualification of PEM approaches, and QML. By implementation of the microelectronic selection criteria spreadsheet, the equipment developer provides the rational for selection of the PEM supplier and the part selected. The data required is mainly available through the supplier and should determine if he is implementing best commercial practices (BCP). This data will assure the parts surpass the equipment quality and reliability requirements. This approach to the use of nonmilitary approved microcircuits is already being implemented on several Army programs which are discussed. The vision is to make the handbook a requirement for all equipment developed at the US Army Communications-Electronics Command (CECOM).
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超出合格制造商名单(QML)
1993年10月25日的微电路应用手册MIL-HDBK-179(ER)正在成为确定微电路封装方法适用性和微电路供应商和零件类型选择标准的陆军指南。本文件基于国防部国防科学委员会提供的建议。多条目矩阵列出了所有可能的国防部设备环境,范围从温度湿度控制到空间。这些应用环境的部件包括商业和工业级塑料封装微电路(PEM), PEM方法的工业认证和QML。通过实施微电子选择标准表格,设备开发人员为PEM供应商和所选部件的选择提供了依据。所需的数据主要通过供应商提供,并应确定其是否正在实施最佳商业实践(BCP)。这些数据将确保零件超过设备的质量和可靠性要求。这种使用非军事批准的微电路的方法已经在讨论的几个陆军项目中实施。其愿景是使该手册成为美国陆军通信电子司令部(CECOM)开发的所有设备的要求。
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