{"title":"Tin whisker growth from low Ag content micro-alloyed SAC solders","authors":"B. Illés, Barbara Horváth","doi":"10.1109/ISSE.2014.6887583","DOIUrl":null,"url":null,"abstract":"In this paper the tin whisker growth properties of lead-free SAC (SnAgCu) solder alloys were investigated. There different alloys were studied: two micro-alloyed SAC (SnAgCu+Bi+Sb) and the widely applied SAC305 as reference. FR4 test board was developed for 18 pieces of 0805 chip resistor components. Solder joints were fabricated on imm-Sn surface finish. The samples were aged in elevated temperatures and different humidity levels to induce the tin whisker formation. Three kinds of aging conditions have been used: 85°C/85RH%, 105°C/100RH% and 105°C/20RH%. The test duration was 3000 hours. Whisker growth was checked after every 500 hours by scanning electron microscope. It was shown that the lead-free SAC solder alloys can also develop tin whiskers and the whiskering ability depends on the composition of the SAC solders.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887583","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper the tin whisker growth properties of lead-free SAC (SnAgCu) solder alloys were investigated. There different alloys were studied: two micro-alloyed SAC (SnAgCu+Bi+Sb) and the widely applied SAC305 as reference. FR4 test board was developed for 18 pieces of 0805 chip resistor components. Solder joints were fabricated on imm-Sn surface finish. The samples were aged in elevated temperatures and different humidity levels to induce the tin whisker formation. Three kinds of aging conditions have been used: 85°C/85RH%, 105°C/100RH% and 105°C/20RH%. The test duration was 3000 hours. Whisker growth was checked after every 500 hours by scanning electron microscope. It was shown that the lead-free SAC solder alloys can also develop tin whiskers and the whiskering ability depends on the composition of the SAC solders.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
