{"title":"Modelling the reliability of green electronic interconnects","authors":"C. Bailey, H. Lu, C. Yin, S. Stoyanov","doi":"10.1109/AGEC.2004.1290868","DOIUrl":null,"url":null,"abstract":"The adoption of lead-free interconnection materials and other environmentally friendly materials is causing a number of concerns for electronic package manufacturers. In this paper the methodology and results of using computer modelling to study the reliability of flip chips with lead-free solder, anisotropic conductive adhesive films and isotropic adhesives interconnects are discussed. It is shown that with currently available material data and computer modelling techniques many useful trends in reliability can be predicted and the results can be used to improve the initial product design and speed up the material section process.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"24 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AGEC.2004.1290868","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The adoption of lead-free interconnection materials and other environmentally friendly materials is causing a number of concerns for electronic package manufacturers. In this paper the methodology and results of using computer modelling to study the reliability of flip chips with lead-free solder, anisotropic conductive adhesive films and isotropic adhesives interconnects are discussed. It is shown that with currently available material data and computer modelling techniques many useful trends in reliability can be predicted and the results can be used to improve the initial product design and speed up the material section process.
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