Impact of Variation in Barrier Thickness on a Gate-Engineered TM-DG Heterostructure MOSFET to Suppress SCE's and it's Analog, RF, Linearity Performance Investigation for SOC Applications

Biswajit Baral, S. Biswal, P. Priya, Sarita Pani, S. Swain
{"title":"Impact of Variation in Barrier Thickness on a Gate-Engineered TM-DG Heterostructure MOSFET to Suppress SCE's and it's Analog, RF, Linearity Performance Investigation for SOC Applications","authors":"Biswajit Baral, S. Biswal, P. Priya, Sarita Pani, S. Swain","doi":"10.1109/EDKCON.2018.8770475","DOIUrl":null,"url":null,"abstract":"In this work, a thorough inspection of DC, Analog, RF, Linearity and SCE's parameter analysis of Gate-Engineered TM-DG heterostructure MOSFET is carried out taking in to account the effect of changing the thickness of the barrier layer. The performance of the proposed device is investigated by evaluating some standard figure of merits (FOMs) like transconductance (g<inf>m</inf>), Output resistance (R<inf>OUT</inf>), Intrinsic Gain (g<inf>m</inf>R<inf>out</inf>), Transconductance Generation factor (g<inf>m</inf>/I<inf>D</inf>), gate capacitance, cutoff frequency(f<inf>T</inf>), maximum frequency of oscillation (f<inf>max</inf>), Gain Bandwidth Product (GBW), VIP2, VIP<inf>3</inf>and 1 dB compression. All these FOMs are analyzed by varying the thickness of the barrier from 1 nm to 4 nm using TCAD simulation. The simulation results clarifies that performance of TM-DG heterostructure Metal field effect transistor (1:2:3) is affected as thickness of the barrier is scaled down.","PeriodicalId":344143,"journal":{"name":"2018 IEEE Electron Devices Kolkata Conference (EDKCON)","volume":"183 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Electron Devices Kolkata Conference (EDKCON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDKCON.2018.8770475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

In this work, a thorough inspection of DC, Analog, RF, Linearity and SCE's parameter analysis of Gate-Engineered TM-DG heterostructure MOSFET is carried out taking in to account the effect of changing the thickness of the barrier layer. The performance of the proposed device is investigated by evaluating some standard figure of merits (FOMs) like transconductance (gm), Output resistance (ROUT), Intrinsic Gain (gmRout), Transconductance Generation factor (gm/ID), gate capacitance, cutoff frequency(fT), maximum frequency of oscillation (fmax), Gain Bandwidth Product (GBW), VIP2, VIP3and 1 dB compression. All these FOMs are analyzed by varying the thickness of the barrier from 1 nm to 4 nm using TCAD simulation. The simulation results clarifies that performance of TM-DG heterostructure Metal field effect transistor (1:2:3) is affected as thickness of the barrier is scaled down.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
势垒厚度变化对栅极工程TM-DG异质结构MOSFET抑制SCE及其SOC应用模拟、射频、线性性能的影响
在本工作中,考虑到改变势垒层厚度的影响,对Gate-Engineered TM-DG异质结构MOSFET进行了直流、模拟、射频、线性和SCE参数分析。通过评估跨导(gm)、输出电阻(ROUT)、固有增益(gmRout)、跨导产生因子(gm/ID)、栅极电容、截止频率(fT)、最大振荡频率(fmax)、增益带宽积(GBW)、VIP2、vip3和1db压缩等标准优点图(FOMs)来研究该器件的性能。通过TCAD模拟,将势垒厚度从1 nm改变到4 nm,分析了所有这些FOMs。仿真结果表明:TM-DG异质结构金属场效应晶体管(1:2:3)的性能随着势垒厚度的减小而受到影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Stability Performance Comparison of a MTJ Memory Device Using Low-Dimensional HfO2, A12O3, La2O3 and h-BN as Composite Dielectric Stress Tuning in NanoScale FinFETs at 7nm Modeling Short Channel Behavior of Proposed Work Function Engineered High-k Gate Stack DG MOSFET with Vertical Gaussian Doping Study of Ag Doped SnO2 Film and its Response Towards Aromatic Compounds Present in Tea Stress Analysis in Uniaxially Strained-SiGe Channel FinFETs at 7N Technology Node
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1