{"title":"Ltcc Mcm Technology for Military Environments","authors":"D. R. Schroeder, L.J. Rexing","doi":"10.1109/ICMCM.1994.753616","DOIUrl":null,"url":null,"abstract":"The design guidelines currently being incorporated in the design and fabrication of LTCC MCM's will be reviewed and compared to MCM-L and MCM-D design guidelines. Several examples of complex MCM's will be presented ranging in size up to 3\" x 3\" incorporating wire bonding as well as tab bonding. LTCC MCM technology has been established as a flexible cost effective advanced packaging concept for harsh environments.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753616","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The design guidelines currently being incorporated in the design and fabrication of LTCC MCM's will be reviewed and compared to MCM-L and MCM-D design guidelines. Several examples of complex MCM's will be presented ranging in size up to 3" x 3" incorporating wire bonding as well as tab bonding. LTCC MCM technology has been established as a flexible cost effective advanced packaging concept for harsh environments.
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