Heat Dissipation for LED Lighting: Vapor Chamber Substrate Printed Circuit Board

Abstract

Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. In this paper, a novel substrate technology for an effective solution to two major problems that affect the heat dissipation performance has been introduced. (1) The non-uniform junction temperature of the module across the LED arrays and the uneven operational temperature of LED arrays; (2) The high operational temperature caused by the accumulated heat. This new type of Vapor chamber substrate printed circuit board (PCB) consists of a thermally-conductive Vapor chamber substrate which is insulated by a dielectric layer of aluminum nitride (ALN). Circuit is formed on the dielectric layer with pulse magnetron sputtering technology. Experimental results in the form of average temperature show that the vapor chamber substrate PCB can improve the temperature uniformity. And good thermal performance for high power LED arrays can also be achieved.