J. Laskar, A. Sutono, C. Lee, M.F. Davis, M. Maeng, N. Lal, K. Lim, S. Pinel, M. Tentzeris, A. Obatoyinbo
{"title":"Development of integrated 3D radio front-end system-on-package (SOP)","authors":"J. Laskar, A. Sutono, C. Lee, M.F. Davis, M. Maeng, N. Lal, K. Lim, S. Pinel, M. Tentzeris, A. Obatoyinbo","doi":"10.1109/GAAS.2001.964381","DOIUrl":null,"url":null,"abstract":"This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. An LTCC-based 14 GHz transmitter for satellite outdoor unit, an OC-192 transmitter incorporating Ku-band Optical Sub-Carrier Multiplexing (OSCM) technique as well fully-organic SOP transmission lines and lumped-element components have been demonstrated. These prototypes suggest the feasibility of developing highly miniaturized cost-effective SOP transceivers applicable not only for wireless but also for optoelectronics links.","PeriodicalId":269944,"journal":{"name":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"31","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.2001.964381","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 31
Abstract
This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. An LTCC-based 14 GHz transmitter for satellite outdoor unit, an OC-192 transmitter incorporating Ku-band Optical Sub-Carrier Multiplexing (OSCM) technique as well fully-organic SOP transmission lines and lumped-element components have been demonstrated. These prototypes suggest the feasibility of developing highly miniaturized cost-effective SOP transceivers applicable not only for wireless but also for optoelectronics links.
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