Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI:10.1109/ECTC.1997.606299

R. L. Shook, V. Sastry

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引用次数: 17

Abstract

The purpose of this work was to determine the influence of preheat and maximum solder reflow temperature on the level of moisture induced damage in plastic surface mount integrated circuits. Both an analytical moisture diffusion model and Finite Element Modeling were applied to the analysis of absorption/desorption behavior of plastic molding compounds. The models were used to analyze the moisture ingress kinetics during controlled environmental exposures and for the prediction of moisture desorption characteristics during solder reflow conditions. Moisture/reflow experiments were conducted on an 80-pin PQFP, 225-pin PBGAs, and two TSOPs (a 56-pin and a 40-pin). Devices were evaluated using C-mode Scanning Acoustic Microscopy. Effects of maximum reflow temperature on measured damage response were determined showing that as a rule the JEDEC/IPC moisture resistance drops by one level for every 20/spl deg/C increase in maximum reflow temperature. The overall benefit of extended preheat is shown to be beneficial for only thin packages that are not saturated. Details of the method used for predicting the beneficial effects of preheating are described.

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预热和焊流曲线最高温度对湿敏集成电路的影响

这项工作的目的是确定预热和最高焊料回流温度对塑料表面贴装集成电路中水分引起的损坏水平的影响。采用解析式水分扩散模型和有限元模型对塑料成型化合物的吸附/解吸行为进行了分析。这些模型用于分析受控环境暴露下的吸湿动力学，并用于预测焊料回流条件下的吸湿特性。在80针PQFP、225针PBGAs和两个tsop(56针和40针)上进行了水分/回流实验。使用c型扫描声学显微镜对设备进行评估。测定了最高回流温度对测量损伤响应的影响，结果表明，最高回流温度每升高20/spl℃，JEDEC/IPC抗湿性下降一级。延长预热的总体好处被证明是有益的，只有薄包装，不饱和。详细介绍了用于预测预热有益效果的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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1997 Proceedings 47th Electronic Components and Technology Conference

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