Innovative Approach of efficient High Humidity and High Temperature Reverse Bias Testing as significant Qualification Method for Power Electronic Modules

Abstract

The field of today’s power electronics is exposed to continuously increasing requirements. Key issues such as energy efficiency, cost savings and reliability with a simultaneous increase of power represent the new challenges. By innovative wideband gap semiconductor technologies, copper wire bonding, and silver sintered or diffusion soldered layers for die-attach higher temperature limits and current densities can still be realized. In the course of this power modules must be protected against fatigue. In particular these high stresses affect the reliability of modules and therefore the life time.