A hierarchy bitline boost scheme for sub-1.5 V operation and short precharge time on high density FeRAM

H. Kang, H. Kye, Geun-Il Lee, Je-Hoon Park, Jun-Hwan Kim, Seaung-Suk Lee, S. Hong, Young-Jin Park, Jin-Yong Chung
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引用次数: 5

Abstract

This work develops three concepts: low-voltage operation with boost voltage control of bitline and plateline, reduced bitline capacitance with multiple divided sub cell array, and increased chip performance with write operation sharing both active and precharge time period. A 256 kb test chip with 3.0/spl times/1.0 /spl mu/m/sup 2/ 1T1C memory cells in 0.25 /spl mu/m design roles is expected to achieve 180 ns access and 70 ns precharge at 1.5 V based on internal probing.
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一种用于高密度FeRAM的低于1.5 V工作和短预充时间的分层位线升压方案
这项工作提出了三个概念:低电压操作与升压控制的位线和平板线,减少位线电容与多分子单元阵列,并提高芯片性能写操作共享有源和预充电时间。一个256 kb的测试芯片,具有3.0/spl次/1.0 /spl mu/m/sup 2/ 1T1C存储单元,设计角色为0.25 /spl mu/m,预计可实现180 ns访问和70 ns基于内部探测的1.5 V预充电。
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